Apparatus and method for soldering electronic components to printed circuit boards

摘要

An automated soldering apparatus includes a conveyor for transporting a printed circuit board along a predetermined path, a fluxer located below the conveyor for coating the circuit board and the electronic components with flux, and a preheater located downstream of the fluxer for heating the circuit board and the electronic components to a predetermined temperature. A molten solder bath is provided downstream of the preheater for applying a molten solder to selected areas of the circuit board. A cooling assembly is arranged downstream of and adjacent to the molten solder bath. The cooling assembly is operable to cool the applied molten solder at a rate of approximately as high as 1.0° C. per second until the molten solder reaches its solidus temperature.