| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor sealing that can give cured products having excellent flame retardancy, heat resistance and reliability. SOLUTION: The epoxy resin for semiconductor sealing comprises (a) an epoxy resin, (b) a curing agent, (c) a polycarbonate, (d) an organopolysiloxane represented by the following average composition formula (1): R<SP>1</SP><SB>a</SB>R<SP>2</SP><SB>b</SB>Si(OR<SP>3</SP>)<SB>c</SB>(OH)<SB>d</SB>O<SB>(4-a-b-c-d)</SB>...(1) (wherein R<SP>1</SP>is phenyl; R<SP>2</SP>is a 1-6C monovalent hydrocarbon group or H; R<SP>3</SP>is 1-4C monovalent hydrocarbon group; a, b, c, d are each a number satisfying the following formulas: 0≤a≤2.0, 0≤b≤1.0, 0≤c≤2.5, 0≤d≤0.35, 0.92≤a+b+c+d≤2.8) and (g) an inorganic filler. COPYRIGHT: (C)2003,JPO
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