发明名称 |
Wire bonding apparatus with spurious vibration suppressing structure |
摘要 |
In a wire bonding apparatus including a horn driver for generating ultrasonic waves, a capillary, an ultrasonic horn formed by a symmetrical section fixed to the horn driver and an asymmetrical section having an end for mounting the capillary, the asymmetrical section is constructed by a spurious vibration suppressing structure for suppressing a vibration component of the ultrasonic horn perpendicular to a propagation direction of the ultrasonic waves with the ultrasonic horn.
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申请公布号 |
US6575348(B2) |
申请公布日期 |
2003.06.10 |
申请号 |
US20020164069 |
申请日期 |
2002.06.06 |
申请人 |
NEC ELECTRONICS CORPORATION |
发明人 |
KIMURA NAOTO;MATSUKUMA HIDEMI |
分类号 |
H01L21/60;B23K20/00;(IPC1-7):B23K1/06;B23K37/00;B23K31/02 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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