发明名称 ENCAPSULATION COVER FOR ORGANIC ELECTROLUMINESCENCE PANEL
摘要 PURPOSE: An encapsulation cover for an organic electroluminescence panel is provided to improve the durability with respect to stress and impact by forming ribs on a surface of a planar encapsulation cover. CONSTITUTION: An encapsulation cover is provided with a connecting surface(32) and a base surface(30). The connecting surface(32) is connected to a device. The base surface(30) is stepped to the connecting surface(32) and has a rectangle shape. Ribs(40a-40d) are provided on the base surface(30) in a diagonal direction. Horizontal and vertical ribs(42a-42d) are provided on the base surface(30). The ribs(40a-40d,42a-42d) distribute stress and impact. Each of the ribs(40a-40d,42a-42d) has a polygonal cross-section.
申请公布号 KR20030044665(A) 申请公布日期 2003.06.09
申请号 KR20010075503 申请日期 2001.11.30
申请人 ORION ELECTRIC CO., LTD. 发明人 PARK, SANG HYEON
分类号 H05B33/04;(IPC1-7):H05B33/04 主分类号 H05B33/04
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