SEMICONDUCTOR PACKAGE FABRICATING EQUIPMENT HAVING APPARATUS FOR AUTOMATICALLY TRANSFERRING TRAY AND AUTOMATIC TRANSFERRING METHOD THEREOF

摘要

PURPOSE: Semiconductor package fabricating equipment having an apparatus for automatically transferring a tray is provided to prevent the whole equipment from being stopped by automatically supplying and ejecting the tray. CONSTITUTION: A trimming/forming unit separates a lead frame material into pieces. A plurality of vacant trays having each separated semiconductor package are stacked in a supply unit(5). A plurality of trays, which include each separate semiconductor package transferred from the supply, are stacked in an ejection unit(7). A tray transfer unit(20) automatically supplies the plurality of vacant trays to the supply unit and automatically ejects the plurality of trays stacked in the ejection unit.