发明名称 ENCAPSULATION CAP OF ORGANIC ELECTROLUMINESCENCE DEVICE
摘要 PURPOSE: An encapsulation cap of an organic electroluminescence device is provided to prevent the thermal expansion damage by using a glass as a material of the encapsulation cap. CONSTITUTION: A rectangular flat plate(130) is made of a glass material. A frame(140) has an opened center in order to form a seal line. The flat plate(130) is adhered to the frame(140) by a glass frit(150) mixed of a glass and an inorganic material. Thermal expansion coefficients of the flat plate(130), the frame(140), and the glass frit(150) are identical to each other. The glass frit(150) is applied to a contacting surface of the flat plate(130) and the frame(140), and the contacting surface is fired at predetermined temperature to adhere the flat plate(130) to the frame(140). The firing temperature is over 350°C. The frame(140) is comprised of plural glass bars.
申请公布号 KR20030044656(A) 申请公布日期 2003.06.09
申请号 KR20010075494 申请日期 2001.11.30
申请人 ORION ELECTRIC CO., LTD. 发明人 PARK, SANG HYEON
分类号 H05B33/04;(IPC1-7):H05B33/04 主分类号 H05B33/04
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