发明名称 CLEANING EQUIPMENT AND CLEANING METHOD OF SEMICONDUCTOR SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To solve the problem of a conventional tubular cleaning brush performing scrub cleaning in cleaning equipment while applying the brush to the plane of a substrate being cleaned that particles, e.g. abrasive, remain at its circumferential edge because the cleaning brush does not touch the bevel part, i.e., the circumferential edge of the substrate, and to provide a cleaning method and cleaning equipment of substrate where the problem is solved. SOLUTION: The cleaning equipment of substrate comprises tubular cleaning brushes 2a and 2b rotating about the respective shafts to perform scrub cleaning between the surfaces thereof and the planes of a substrate 11 being cleaned, and a member 3 touching and cleaning the circumferential edge of the substrate. Each scrub cleaning brush 2a, 2b has a shape rendered to copy the bevel part 6 of the substrate 11 by making thick the opposite ends of a brush shaft 5, and cleans the bevel part 6 of the substrate 11. The circumferential edge cleaning member 3 is fixed to a part along the circumferential edge of the substrate 11 and cleans the circumferential edge of the substrate 11 while rotating together with the substrate 11 and moving up and down. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003163196(A) 申请公布日期 2003.06.06
申请号 JP20010361809 申请日期 2001.11.28
申请人 KAIJO CORP 发明人 SHINOHARA EMIKO;OKANO KATSUICHI;TAKAHASHI OSAMU
分类号 H01L21/304;(IPC1-7):H01L21/304 主分类号 H01L21/304
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