发明名称 PREPREG FOR PRINTED WIRING BOARD AND MULTILAYER PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To reduce a difference between vertical and horizontal dimensional changes and to reduce the dispersion of dimensional changes in a printed wiring board and a multilayer printed wiring board. SOLUTION: In prepreg for a multilayer printed wiring board and the multilayer printed wiring board, glass fiber fabric of which texture density ratio of vertical and horizontal fibers is vertical/horizontal = 0.67 to 0.090 and weight is 20 to 110 g/m<SP>2</SP>is used and a difference between vertical and horizontal dimensional changes is≤0.005%. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003163462(A) 申请公布日期 2003.06.06
申请号 JP20020263808 申请日期 2002.09.10
申请人 HITACHI CHEM CO LTD 发明人 NAKANO NAOKI;KUMAGAI TAKU
分类号 C08J5/24;H05K1/03;H05K3/46;(IPC1-7):H05K3/46 主分类号 C08J5/24
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