| 摘要 |
PROBLEM TO BE SOLVED: To provide a sealing cap for an electronic element package having high sealing reliability and a good conveying efficiency, and to provide a method for manufacturing the same and a method for sealing the package. SOLUTION: The sealing cap for the electronic element package comprises a brazing material layer arranged on the outer periphery of the one side surface of the cap formed of a lithography made of a metal, and a layer formed of the brazing material containing an Au and an Sn by a printing method. The method for manufacturing the cap is provided. The method for sealing the package using the cap is provided. COPYRIGHT: (C)2003,JPO
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