| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an apparatus capable of clamping any type of work-piece so that the height of wire bonded points is held constant. <P>SOLUTION: The work-piece clamping apparatus which clamps a substrate that IC chips are fixed to, can clamp any type of work-piece from among various types of work-pieces. This clamping apparatus comprises a top face pressure mask 10 abutting against a top face of the work-piece and a table 14 that moves upward while the work-piece is mounted thereon. In a lower surface of the top face pressure mask 10, an abutting shape specific to each work-piece type, which abuts against the top face of each type of work pieces, is formed. For example, a type A of work-piece abuts against an abutting shape A specially prepared for the type A and a type B of work-piece abuts against an abutting shape B specially prepared for the type B. The height of the abutting shape, which is specific to each work-piece type, is set so that the height of wire bonding points is held at a constant height without depending on the types of work-pieces. <P>COPYRIGHT: (C)2003,JPO |
