| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a treatment method using discharge plasma capable of realizing a stable discharge state under an atmospheric condition and being treated in a simple device and a small amount of a treatment gas in removing treatment of a remaining photo-resist in a semiconductor manufacturing process. <P>SOLUTION: In the removing treatment method of the remaining photo-resist in the semiconductor manufacturing process, at least one opposite face of a pair of opposite electrodes is covered with a solid dielectric under a pressure in the neighborhood of an atmospheric pressure, and glow discharge plasma obtained by introducing the treatment gas containing 1-50 vol.% of oxygen and applying an electric field between the pair of the electrodes is brought into contact with an object to be treated. <P>COPYRIGHT: (C)2003,JPO |
