| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for mounting a chip whose quality is stabilized by improving productivity with less plant investment cost and space. <P>SOLUTION: By using a single printing machine 10, a cream solder 4 is printed on a land 3a of a board 1. Then the board 1 is selectively carried in a plurality of mounter devices 12A, 12B and 12C placed in parallel between a carrying-in conveyer 13 and a carrying-out conveyer 14. By using the mounter devices 12A, 12B and 12C, a chip 2 is mounted on the land 3a of the board 1. Then the board 1 carried out from each mounter device, 12A, 12B and 12C, is carried in a single reflow furnace 11. The cream solder 4 is melted in the reflow furnace 11 to reflow-solder the chip part 2 on the land 3a. <P>COPYRIGHT: (C)2003,JPO |
