| 摘要 |
PROBLEM TO BE SOLVED: To improve the performance of a semiconductor integrated circuit, especially to inhibit jitter by increasing the cooling capability. SOLUTION: The cooling structure of a semiconductor integrated circuit comprises a first heat spreader 1A that comes into contact with the back of a semiconductor chip X, and at the same time forms a first passage C1 for sending cooling water W inside; and a second heat spreader 1B that comes into contact with the front of the semiconductor chip X via a compound 8, and forms a second passage C2 for sending the cooling water W inside. COPYRIGHT: (C)2003,JPO |
