| 摘要 |
PROBLEM TO BE SOLVED: To meet such a demand as forming plating films of several combinations continuously in one conveyance rail, and plating films of high qualities with uniform thickness on a lead frame and on the lead surface. SOLUTION: A plating apparatus arranges several plating tanks under the conveyance rail, and arranges plating-liquid storage tanks beside the plating tanks, so that it can select the kind of the plating films to be formed on a conductive member 21, by means of moving the plating liquid back and forth between the plating tank and the plating-liquid storage tank. Then, the apparatus can continuously form plating films of several combinations on the conductive member 21 with one conveyance rail. COPYRIGHT: (C)2003,JPO
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