METHOD FOR MANUFACTURING WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a wiring board manufacturing method capable of forming an insulating resin layer by laminating insulating resin films on a wiring board without generating void. SOLUTION: Insulating resin films 3 are superposed on the surfaces of a wiring board 2 on which a circuit 1 is formed and the films 3 and the board 2 are molded by heating and pressing them through elastic bodies 6 between heat boards 4 to laminate the films 3 on the surfaces of the board 2 as an insulating resin layer 5. In this case, heat/pressure molding in pressure reduced atmosphere is executed in a state of arranging ventilation sheets 9 consisting of meshes or mat sheets whose surfaces are roughed between each elastic body 6 and each resin film 3. COPYRIGHT: (C)2003,JPO