| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for liquid sealing which has a low dielectric constant and a small dielectric loss even in a high-frequency region and is also suitable for flip chip sealing. SOLUTION: This resin composition contains (A) a cyanate ester resin, (B) an oxetane-containing compound and (C) a cationic curing catalyst. COPYRIGHT: (C)2003,JPO
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