| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package which is excellent in transmission efficiency of high frequency signals and in airtightness. SOLUTION: A circuit substrate 6 to be mounted on an upper principal plane of a base 1 consists of; a line conductor 6a disposed on an insulating substrate, one end and the other end electrically connected to a central conductor 3b and a semiconductor element 5, respectively; and double side grounding conductors 6c which are formed on both sides of the line conductor 6a, respectively, at substantially the same distance therefrom. The side surface of the insulating substrate at the one end side of the line conductor 6a is in contact with the inner surface of a frame 2. A substantially semicylindrical roof-shaped member 12 extends from the inner surface of the frame 2 to a joint between the central conductor 3b and the line conductor 6a, and is bonded onto the conductors 6c so as to cover the joint, coaxial therewith. COPYRIGHT: (C)2003,JPO |
