| 摘要 |
PROBLEM TO BE SOLVED: To exclude uneconomical design and consideration wherein bonding strength is increased unnecessarily, by defining design guideline in which falling impact resistance of an electronic component mounted on a circuit board is made necessary and sufficient, regarding a bonding method of an electronic component. SOLUTION: Electrical connection between a bonding terminal of the electronic component and a bonding terminal of the circuit board 14, or electrical connection between bonding terminals of the respective electronic components, is performed. A part between the electronic component and the circuit board 14 on an outer periphery of the electronic component, or a part between the respective electronic components on the outer peripheries of the electronic components is filled with resin adhesive agent 15. Resonance frequency f [Hz] of the mounted electronic component is set as f≥10000. COPYRIGHT: (C)2003,JPO
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