| 摘要 |
<P>PROBLEM TO BE SOLVED: To appropriately secure noise-resistance of a semiconductor device without depending on a case connector connected to a resin-sealed semiconductor device. <P>SOLUTION: A semiconductor device S1 is molded so that an IC chip 10 and a lead frame 30 electrically connected to the IC chip 10 are encapsulated with resin 40. The IC chip 10 has a filter for cutting noise at a relatively high- frequency range in the inside. At the inside of the resin 40, a chip capacitor 50 is provided, where the chip capacitor 50 is electrically connected to the lead frame 30, and cuts noise at a relatively low-frequency range to the IC chip 10. <P>COPYRIGHT: (C)2003,JPO |
