发明名称 APPARATUS FOR WIRE BONDING
摘要 <p><P>PROBLEM TO BE SOLVED: To achieve the stable formation of a ball by compensating paths of sparks, and to prevent the adhesion of contaminations to a discharge electrode. <P>SOLUTION: Sub-electrodes 4a, 4b, 4c, 4d are disposed so as to surround a region lying between a tip of a wire 2 and a tip of the discharge electrode 3. An electric field of the sub-electrode 4a, 4c enables an end of a wire 2 side in the spark 8 to be led on the axis of a part protruding from a capillary 1 in the wire 2, and thus the incomplete formation of the ball can be prevented. An electric field of the sub-electrodes 4b, 4d enables an end of a discharge electrode 3 side in the spark 8 to be led on the axis of the discharge electrode 3, and thus the unstable formation of the ball, caused by the shift of the position of the end of the discharge electrode 3 side in the spark 8 from the tip of the discharge electrode 3 to the root side, can be prevented. By the action of the electric field of the sub-electrode 4b, ionized ions can be adsorbed. <P>COPYRIGHT: (C)2003,JPO</p>
申请公布号 JP2003163235(A) 申请公布日期 2003.06.06
申请号 JP20010364532 申请日期 2001.11.29
申请人 SHINKAWA LTD 发明人 MORITA NAOKI
分类号 H01L21/60;B23K20/00;H01L21/00;(IPC1-7):H01L21/60 主分类号 H01L21/60
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