| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor chip that has a chip selection terminal and can connect different types of terminals by stacking, to provide a stacked semiconductor electronic component using the semiconductor chip, and to provide a manufacturing method of the stacked semiconductor electronic component. <P>SOLUTION: The semiconductor chip comprises a chip selection electrode 121 where a chip selection signal for setting an internal circuit to an operation state or a non-operation state is inputted, connection terminals 121-134 and 104e-104q that include chip selection terminals 131-134 that are exposed to the front and rear of the chip, and a connection line that connects the chip selection electrode 121 and the chip selection terminals 131-134 in continuity and is capable of cutting so that only one of the chip selection terminals 131-134 can be connected to the chip selection electrode 121. While the chip selection electrode 121 of each semiconductor chip 100 is connected to only mutually different chip selection terminals 131-134, connection terminals are connected to compose a stacked semiconductor electronic component 10 where a plurality of semiconductor chips 100 are stacked. <P>COPYRIGHT: (C)2003,JPO</p> |
