| 摘要 |
PROBLEM TO BE SOLVED: To provide a cutting machine capable of locating the center and the crystal orientation of a semiconductor wafer conveyed out of a cassette to a temporal depository area. SOLUTION: A cutting machine comprising a chuck table 3 to retain a semiconductor wafer 10, a cutting mechanism to cut the semiconductor wafer retained by the chuck table, a cassette mounting mechanism 8 equipped with a cassette table 81 to mount a cassette 7 housing the semiconductor wafer, a temporal depository area to temporarily store the semiconductor wafer conveyed out of the cassette mounted on the cassette table, a first conveying mechanism 14 to convey the semiconductor wafer conveyed out to the temporal depository area onto the chuck table, and a second conveying mechanism 16 to convey the semiconductor wafer cut and machined on the chuck table, wherein the temporal depository area is provided with a location matching mechanism 12 comprising a center adjusting means that adjusts the center of the semiconductor wafer and a crystal orientation adjusting means 138 that adjusts the crystal orientation of the semiconductor wafer. COPYRIGHT: (C)2003,JPO |
