| 摘要 |
PROBLEM TO BE SOLVED: To obtain a mold package for semiconductor devices that uses an intermediate wiring board for shortening the wire between a semiconductor chip and a lead frame and can prevent deterioration in high-frequency characteristics and displacement of the wire, and to obtain a method for manufacturing the mold package for semiconductor devices. SOLUTION: The mold package for semiconductor devices is equipped with a lead frame 12, an intermediate wiring board 13 for high frequencies that is provided on the lead frame 12, and a semiconductor chip 14 connected to the lead frame 12 via the intermediate wiring board 13. COPYRIGHT: (C)2003,JPO |
