| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a circuit board in which a high-accuracy circuit pattern is formed at least on one face by suppressing the deformation of a flexible film whose dimension is easy to change due to the influence of heat, humidity and an external force. SOLUTION: In the method of manufacturing the circuit board, a reinforcing sheet and the flexible film are pasted via an organic substance layer capable of being stripped, the circuit pattern is formed on a face on which the flexible film is not pasted on the reinforcing sheet, and the flexible film is stripped. In the method of manufacturing the circuit board, the product A×B×C of a release force A (g/cm) used to strip the flexible film multiplied by an inverse number B (μm<SP>-1</SP>) of the thickness of the flexible film, and an inverse number C (mm<SP>2</SP>/kg) of Young's modulus of the flexible film is within a range of 4.3×10<SP>-6</SP>to 4.3×10<SP>-3</SP>. COPYRIGHT: (C)2003,JPO
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