发明名称 APPARATUS FOR WIRE BONDING
摘要 <p><P>PROBLEM TO BE SOLVED: To prevent deterioration in acquired image quality even if a light source for illumination through a lens pipe of a position detecting camera is turned on. <P>SOLUTION: An apparatus according to the present invention comprises a tool 4 for bonding to bonding parts, the position detecting camera 7 with the lens pipe 8 for picking up the images of the bonding parts, the light source 14 for illumination through the lens pipe 8 downwards, and an optical path changing means 20 for leading the images close to a lower part of the tool 4 to the lens pipe 8. The optical path changing means 20 is provided with a filter 30 for wavelength selection, by which the light from the light source 14 is passed and the light from the lighting means 25 is not passed, above a mirror 22 for reflecting the images close to the lower part of the tool 4 upward. <P>COPYRIGHT: (C)2003,JPO</p>
申请公布号 JP2003163236(A) 申请公布日期 2003.06.06
申请号 JP20010360218 申请日期 2001.11.27
申请人 SHINKAWA LTD 发明人 HAYATA SHIGERU
分类号 H01L21/60;B23K20/00;H01L21/00;(IPC1-7):H01L21/60 主分类号 H01L21/60
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