| 摘要 |
PROBLEM TO BE SOLVED: To provide a reliable semiconductor chip that does not require any special components, a manufacturing method, and facilities, and the like, and can improve integration density, to provide a semiconductor wafer and its dicing method, and to provide a stacked semiconductor device. SOLUTION: In the semiconductor chip 20 in one embodiment where a specific integrated electronic circuit and a plurality of bonding pads connected to the specific integrated circuit are arranged in a specific arrangement, each of the bonding pads has a plurality of connection pads 22a, 22b, 22c, and 22d for connecting a wire W (Figs. 2 and 3). A semiconductor chip 20A where the area between connection pads that are provided at both sides of the semiconductor chip 20 is widest is fixed to a die pad 41 of a lead frame 40, and then semiconductor chips 20B, 20C, and 20D having short widths are successively stacked on it, thus composing the stacked semiconductor device 30A. COPYRIGHT: (C)2003,JPO
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