METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD AND THE MULTILAYER WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a multilayer wiring board manufacturing method capable of improving spreading of plating on the inwall surface of a connecting hole after forming the connecting hole by laser processing and a multilayer wiring board manufactured by the method.

SOLUTION: Since prepreg 2a more deflecting a base material 1 from the approximately center part of a resin layer 12 to the vicinity of an inner layer substrate 3 in the multilayer wiring board manufactured by the manufacturing method, the base material 1 is deflected from the approximately center part of an insulating layer 6a to the vicinity of the substrate 3. Since a distance between the base material 1 and a metallic part of an inner layer circuit 4 formed on the substrate 3 on the bottom of the connecting hole 7 is short at the time of laser processing, not only the energy of incident light of a laser but also that of reflected light can contribute to the cutting of a projected part of an uncut base material 1 and the projected part of the base material 1 can be easily cut out, so that spreading of plating on the inwall surface of the connecting hole 7 is improved.

COPYRIGHT: (C)2003,JPO