| 发明名称 |
HOT MELT CONDUCTOR PASTE COMPOSITION HOT MELT CONDUCTOR PASTE COMPOSITION |
| 摘要 |
<p>The present invention provides a hot melt conductor paste composition that includes conductive particles and glass particles dispersed in a thermoplast ic polymer system. The hot melt conductor paste composition according to the invention is a solid at room temperature, but melts at a temperature of from about 35~C to about 90~C to form a flowable liquid that can be applied to a silicon substrate by screen printing. The hot melt conductor paste compositi on is particularly suitable for use in the fabrication of photovoltaic cells.</ SDOAB></p> |
| 申请公布号 |
CA2467690(A1) |
申请公布日期 |
2003.06.05 |
| 申请号 |
CA20022467690 |
申请日期 |
2002.11.01 |
| 申请人 |
FERRO CORPORATION |
发明人 |
MCVICKER, KRISTINA H.;SHAIKH, AZIZ S.;MAGRINI, KENNETH A.;WILLIAMS, TODD K.;TOLENTINO, LUIS C. |
| 分类号 |
B05D1/26;B05D1/32;B05D3/02;B05D5/00;B05D5/12;C08J3/00;C08K3/08;C08K3/40;C08L1/00;H01B1/00;H01B1/02;H01B1/22;H01B13/00;H01L23/532;H01L31/0224;H05K1/09;(IPC1-7):H01B1/00 |
主分类号 |
B05D1/26 |
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