| 摘要 |
<p>The present invention relates generally to a system and method for including a thin protective containment thermopolymer film (10), such as PEEK, in the molding process for handlers, transporters, carriers, trays and like devices utilized in the semiconductor processing industry. The thermoplastic film (10) of predetermined size and shape is selectively placed along a shaping surface (26) in a mold cavity (22) for alignment with a desired target surface of a moldable material. The film is permanently adhered to the moldable material. As a result, a compatible polymer film (10) can be selectively bonded only to those target surfaces where performance characteristics such as abrasion resistance, heat resistance, chemical resistance, outgassing containment, rigidity enhancement, hardness, creep reduction, fluid absorption containment, and the like is needed.</p> |
