HIGH-FREQUENCY CIRCUIT BLOCK, ITS MANUFACTURING METHOD, HIGH-FREQUENCY MODULE DEVICE, AND ITS MANUFACTURING METHOD

摘要

A high-frequency module device comprising a high-frequency circuit block equipped with passive elements. Unit wiring layers constituted of insulation layers and pattern wirings having passive elements in a part are stacked on a dummy board and formed by separation from the dummy board. A high-frequency circuit block (2) the main face of each unit wiring layer is flattened is mounted on a mother board (3). The passive element section and the pattern wiring formed on the main face of each unit wiring layer of the high-frequency circuit block (2) are precisely formed to improve high-frequency characteristics. The high-frequency circuit block (2) requires no base boards, so that its size and cost are reduced.