发明名称 Semiconductor device and method for manufacturing the same
摘要 A semiconductor device includes a semiconductor substrate of a first conductivity type, in which an extended drain region of a second conductivity type and a source region of the second conductivity type are formed with an interval therebetween, wherein the extended drain region includes a plurality of buried layers, each formed by burying an impurity layer of the first conductivity type, the plurality of buried layers extending substantially parallel to a substrate surface and with an interval therebetween in a depth direction. A concentration of an impurity of the second conductivity type in the extended drain region at a depth of about 6 mum from the substrate surface is about 1x1015/cm3 or more and is about 30% or more of that at a depth of about 2 mum from the substrate surface.
申请公布号 US2003102507(A1) 申请公布日期 2003.06.05
申请号 US20020307361 申请日期 2002.12.02
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 UNO TOSHIHIKO
分类号 H01L21/265;H01L29/06;H01L29/08;H01L29/78;(IPC1-7):H01L29/76 主分类号 H01L21/265
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