发明名称 Cooling apparatus
摘要 A heat sink comprises a core member comprising at least one first surface adapted to contact at least a portion of the heat source. An one outer peripheral surface is located on the core member. At least one cooling fin device comprising an inner peripheral surface and at least one cooling fin is adjacent the core member. In one embodiment, the inner peripheral surface of the cooling fin device is adjacent the outer peripheral surface of the core member. At least a portion of the outer peripheral surface is tapered, wherein the circumference of the outer peripheral surface in the proximity of the first surface is greater than the circumference of the outer peripheral surface not in the proximity of the first surface.
申请公布号 US2003102110(A1) 申请公布日期 2003.06.05
申请号 US20020164340 申请日期 2002.06.05
申请人 WAGNER GUY R. 发明人 WAGNER GUY R.
分类号 F28F1/10;H01L23/467;(IPC1-7):F28F7/00;H05K7/20;B21D53/02 主分类号 F28F1/10
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