发明名称 |
Laminate having plated microvia interconnects and method for forming the same |
摘要 |
A chip carrier structure and method for forming the same having a receptor pad formed therein. The structure comprises a circuitized substrate having a conductive element on the surface, an External Dielectric Layer mounted on the circuitized substrate with an opening positioned above the conductive element to form a microvia. The walls of the microvia are first treated to enhance copper adhesion and then are electroplated to provide a receptor pad. Finally, a solder paste is deposited within the microvia to create a solder deposit or bump.
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申请公布号 |
US2003102158(A1) |
申请公布日期 |
2003.06.05 |
申请号 |
US20020281463 |
申请日期 |
2002.10.25 |
申请人 |
JIMAREZ MIGUEL A.;KEESLER ROSS W.;MARKOVICH VOYA R.;RAI RAJINDER S.;TYTRAN-PALOMAKI CHERYL L. |
发明人 |
JIMAREZ MIGUEL A.;KEESLER ROSS W.;MARKOVICH VOYA R.;RAI RAJINDER S.;TYTRAN-PALOMAKI CHERYL L. |
分类号 |
H01L21/48;H01L23/498;H05K1/11;H05K3/28;H05K3/34;H05K3/42;H05K3/46;(IPC1-7):H05K1/00;H05K1/03 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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