| 摘要 |
An exposure method for forming on a wafer coated with a photo resist device patterns comprised of dense patterns and isolated patterns as components, including a first step of transferring first patterns comprised of dense patterns of shapes corresponding to the device patterns and dense patterns formed by patterns of shapes corresponding to the isolated patterns of the device patterns plus a plurality of auxiliary patterns on the wafer by ½ of the appropriate amount of exposure as determined by the sensitivity of the photo resist, and a second step of transferring second patterns comprised of dense patterns of shapes corresponding to the dense patterns of the device patterns and isolated patterns of shapes corresponding to the isolated patterns of the device patterns on the photosensitive substrate by ½ of the appropriate amount of exposure.
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