Alternate metallurgy for land grid array connectors

摘要

A process for manufacturing a land grid array connector for a printed wiring board is disclosed. The process does not require electroplating precious metal overlays. Therefore, no commoning bar is required. Another benefit of the invention includes a connector design using only a flash, soft gold application in the outer surface of the connector. Physical hardness and durability are derived from a thin palladium layer lying beneath the flash gold layer.