| 摘要 |
<p>A laminating method for simply introducing an insulation layer which is formed when producing a multilayer printed wiring board by a build-up system and which is low in thermal expansion coefficient and excellent in adhesion with a conductor layer formed by plating after roughening the surface of the insulation layer. A method of laminating a circuit board characterized in that a resin composition layer consisting of specified layer A and layer B is laminated on a support film, the layer A being an adhesive film laminated adjacently to the support film, the layer B being such that an adhesive film having fluidity capable of filling resin into a through hole or a via hole concurrently with the laminating of the circuit board under a lamination condition is laminated so that the layer B directly contacts the circuit board.</p> |
