Disclosed are methods for repairing or enhancing discontinuous metal seed layers disposed on a substrate prior to subsequent metallization such as during the manufacture of electronic devices. Such repair methods do not require the use of a second electroplating bath, but comprise the steps of: contacting a metal seed layer disposed on a substrate with a copper colloid composition comprising a minor amount of ionizable palladium compound and a major amount of copper colloid particles to form a substantially continuous seed layer.
申请公布号
DE60100233(D1)
申请公布日期
2003.06.05
申请号
DE2001600233
申请日期
2001.10.23
申请人
SHIPLEY CO., L.L.C.
发明人
MERRICKS, DAVID;MORRISSEY, DENIS;BAYES, MARTIN W.;LEFEBVRE, MARK;SHELNUT, JAMES G.;STORJOHANN, DONALD E.