发明名称 METHOD OF COOLING HIGH DENSITY ELECTRONICS
摘要 For nuclear imaging of a subject injected with a radioactive isotope, each detector array (18) is associated with event analyzer circuitry (64) and detector array signals due to gamma ray emissions indicative of nuclear decay are processed and reconstructed into an image of the subject anatomy. Cadmium zinc telluride (CZT) crystals (20) outputs are amplified by complex low−noise integrated preamplifier circuits (P−ASIC 60) dissipating 300−500 mW each. Additionally, low−noise linear voltage regulators (66) providing regulated DC power to assure delivery of clean power to the P−ASIC (60), dissipate 150−250 mW each. In order to facilitate cooling of electrical components (60,66) which account for most of the dissipated power on circuit boards (62), the boards (62) are arranged parallel to each other and extend perpendicularly away from the detector array (18) to provide channels between the boards (62) through which cooling air is drawn by an array of fans.
申请公布号 WO03046610(A1) 申请公布日期 2003.06.05
申请号 WO2001US43392 申请日期 2001.11.21
申请人 KONINKLIJKE PHILIPS ELECTRONICS N.V. 发明人 GRIESMER, JEROME, J.;KLINE, BARRY, D.
分类号 G01T1/161;G01T1/20;G01T1/24;G01T7/00;H01L27/14;H01L31/09;H05K7/20;(IPC1-7):G01T1/24 主分类号 G01T1/161
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