发明名称 SEMICONDUCTOR LASER CHIP AND INFRARED EMITTER COMPONENT
摘要 <p>The invention relates to an infrared emitter component with a commercial light-emitting diode (LED) package (11) which has two electrode terminals (13, 14), one of which has a well-shaped reflector (12), and which has an optically transparent, electrically nonconductive encapsulating material (16). The invention provides that a semiconductor laser chip (1) is mounted in the well-shaped reflector (12) of the LED package. The semiconductor laser chip (1) has a quantum-well structure, especially with a strained-layer structure, for example MOVPE epitaxial layers with the layer sequence GaAlAs-InGaAs-GaAlAs. The optically transparent, electrically nonconductive material (16) of the LED package (11) may incorporate a diffuser material (17) which in terms of type and concentration is structured and introduced so as to produce, in conjunction with the semiconductor laser chip (1) encapsulated in the LED package (11), a radiation characteristic or an enlargement of the effective emission surface that is comparable to that of a commercial infrared LED.</p>
申请公布号 EP0839400(B1) 申请公布日期 2003.06.04
申请号 EP19960923857 申请日期 1996.07.16
申请人 OSRAM OPTO SEMICONDUCTORS GMBH & CO. OHG 发明人 BOGNER, GEORG;BRUNNER, HERBERT;HAAS, HEINZ;LUFT, JOHANN;NIRSCHL, ERNST;SPAETH, WERNER;STATH, NORBERT;TEICH, WOLFGANG
分类号 H01L33/54;H01S5/02;H01S5/022;H01S5/18;H01S5/34;(IPC1-7):H01S5/02;H01S5/32 主分类号 H01L33/54
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