| 摘要 |
A polishing apparatus for polishing a workpiece such as a semiconductor wafer includes a polishing section (130) for polishing a surface of the workpiece held by the top ring (137), a cleaning section (150) for cleaning the workpiece which has been polished in the polishing section (130). The polishing apparatus further includes a workpiece transfer robot (1) for transferring the workpiece to be polished to the polishing section (130) or the workpiece which has been polished in the cleaning section (150). The workpiece transfer robot (1) comprises a robot body (10), at least one arm (25) operatively coupled to the robot body (10) by at least one joint (37), a holder mechanism (50) mounted on the arm (25) for holding a workpiece, and a sealing mechanism (41) provided at the joint (37) for preventing liquid from entering an interior of the joint (37). <IMAGE> |
