发明名称 |
Heat dissipation arrangement for electronic components |
摘要 |
Heat is conducted, from a heat generating electronic device that is mounted in a gap between a circuit board and a heat dissipator, along a path that includes a path segment that passes along conductive runs on the circuit board and another segment that spans the gap at a location adjacent to the device, the other path segment being spanned predominantly by a non-metallic piece that has a thermal conductivity of at least 7 W/m-°K. |
申请公布号 |
EP1225631(A3) |
申请公布日期 |
2003.06.04 |
申请号 |
EP20010310846 |
申请日期 |
2001.12.21 |
申请人 |
VLT CORPORATION |
发明人 |
VINCIARELLI, PATRIZIO;SAXELBY, JOHN R., JR |
分类号 |
H01L23/36;H01L23/373;H01L23/433;H05K7/20 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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