发明名称 Heat transfer device
摘要 A heat transfer device comprises a heat source means (1) for evaporating refrigerant through the application of heat, cold heat source means (2) which is connected to the hot heat source means (1) through a gas flow pipe (4) and a liquid flow pipe (5) to form a closed circuit with the hot heat source means (1) and condenses refrigerant by heat radiation, user-side means (3) connected to the gas flow pipe (4) through a gas pipe (6) and to the liquid flow pipe (5) through a liquid pipe (7), gas flow selecting means (8) for changing gas refrigerant flow between the gas flow pipe (4) and the gas pipe (6), liquid flow selecting means (9) for changing liquid refrigerant flow between the liquid flow pipe (5) and the liquid pipe (7), and control means (C) for controlling at least one of the gas flow selecting means (8) and the liquid flow selecting means (9) to change refrigerant flow with respect to the user-side means (3) according to an operation mode of the user-side means (3). Furthermore, there is provided a heat source-side refrigerant circuit (A) which comprises heating heat exchange means (12) for exchanging heat with the hot heat source means (1) to give an amount of heat for evaporating refrigerant to the hot heat source means (1), and cooling heat exchange means (15) for exchanging heat with the cold heat source means (2) to take an amount of heat for condensing refrigerant from the cold heat source means (2) (Fig. 1). <IMAGE>
申请公布号 EP1291587(A3) 申请公布日期 2003.06.04
申请号 EP20020027413 申请日期 1996.09.06
申请人 DAIKIN INDUSTRIES, LTD. 发明人 TANAKA, OSAMU;MATUZAKI, TAKASHI;MIZUTANI, KAZUHIDE;HORI, YASUSHI;INAZUKA, TORU
分类号 F24D7/00;F24F3/06;F24F5/00;F25B1/00;F25B13/00;F25B23/00;F25B25/00;F25B29/00 主分类号 F24D7/00
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