发明名称 |
Wafer level insulation underfill for die attach |
摘要 |
A process for forming an insulation underfill for soldering semiconductor die solder balls by a solder paste on conductive traces on a support surface. The process comprises the screen printing or deposition from a syringe of thermoplastic or thermosetting epoxy columns between the solder balls, to a height equal to the standoff height of the die from the support surface. The assembly is first heated to a temperature at which the plastic becomes semifluid and before the area over which it will spread becomes contaminated with flux residue; and is next heated to the solder paste reflow temperature.
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申请公布号 |
US6573122(B2) |
申请公布日期 |
2003.06.03 |
申请号 |
US20020106927 |
申请日期 |
2002.03.26 |
申请人 |
INTERNATIONAL RECTIFIER CORPORATION |
发明人 |
STANDING MARTIN |
分类号 |
H01L21/56;H05K3/30;H05K3/34;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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