发明名称 Non-rectangular thermo module wafer cooling device using the same
摘要 A non-rectangular thermo module is formed by disposing a plurality of Peltier devices between a pair of heat radiating plates, wherein the heat radiating plate has a circular or straight outer peripheral contour portion and inner peripheral contour portion and right/left side edge contour portions connecting the outer peripheral contour portion and the inner peripheral contour portion and the outer peripheral contour portion is formed longer than the inner peripheral contour portion while the right/left side edge contour portions contain first straight lines which are not parallel and inclined toward the inner peripheral contour portion such that they narrow gradually, the first straight lines being provided at least in part of the right/left side edge contour portions.
申请公布号 US6573596(B2) 申请公布日期 2003.06.03
申请号 US20010998634 申请日期 2001.12.03
申请人 SMC CORPORATION 发明人 SAIKA MASAO
分类号 F25B21/02;H01L21/324;H01L23/367;H01L23/38;H01L35/32;(IPC1-7):H01L23/34 主分类号 F25B21/02
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