| 摘要 |
Disclosed is apparatus, and a method, for providing increased cooling air flow for a computer, particularly a thin server mounted in an enclosure (e.g., a cabinet). The thin server has holes in one side thereof, in addition to holes in the front and back, for increased vent openings for air flow, especially for exit of warmed air. The apparatus includes a spacer rail along the one side of the thin server having the holes, the spacer rail exposing the holes. In mounting the thin server in a cabinet, the spacer rail, and the side of the thin server opposite the side having the holes, are fastened to (supported by) the sides of the cabinet, to mount the thin server in the cabinet.
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