发明名称 |
Flip chip image sensor package fabrication method |
摘要 |
A method of fabricating a flip chip image sensor package includes forming an aperture in a substrate and mounting an image sensor to the substrate. The image sensor is mounted such that an active area of the image sensor is aligned with the aperture. A bead is formed around a periphery of the image sensor. An aperture side of the aperture, the image sensor, and the bead define a pocket. The method further includes filling the pocket with a transparent liquid encapsulant and hardening the transparent liquid encapsulant. The hardened transparent liquid encapsulant serves as the window for the flip chip image sensor package.
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申请公布号 |
US6571466(B1) |
申请公布日期 |
2003.06.03 |
申请号 |
US20000536830 |
申请日期 |
2000.03.27 |
申请人 |
AMKOR TECHNOLOGY, INC. |
发明人 |
GLENN THOMAS P.;WEBSTER STEVEN;HOLLAWAY ROY DALE |
分类号 |
H01L27/146;H01L31/0203;(IPC1-7):H05K3/30 |
主分类号 |
H01L27/146 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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