发明名称 |
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, NARROW PITCH CONNECTOR, ELECTROSTATIC ACTUATOR, PIEZOELECTRIC ACTUATOR, INK JET HEAD, INK JET PRINTER, MICROMACHINE, LIQUID CRYSTAL PANEL, AND ELECTRONIC DEVICE |
摘要 |
A manufacturing method of semiconductor devices, micromachines such as semiconductor device, narrow pitch connectors, electrostatic actuators or piezoelectric actuators, and ink jet heads, ink jet printers, liquid crystal panels, and electronic appliances, including them characterized in that short circuit due to dusts floating in the air will not take place. In a method where a silicon wafer (30) undergoes dicing to manufacture semiconductor devices (20), a groove (30a) covered by an insulating layer and spanning a dicing line is formed in the above described silicon wafer, and the silicon wafer undergoes dicing along the dicing line.
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申请公布号 |
US6573157(B1) |
申请公布日期 |
2003.06.03 |
申请号 |
US20000701300 |
申请日期 |
2000.12.13 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
SATO EIICHI |
分类号 |
B81B1/00;B81B7/00;H01L21/78;H01L23/552;H01L23/58;H01L41/08;H01R31/06;H02N2/04;(IPC1-7):H01L21/301 |
主分类号 |
B81B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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