| 发明名称 |
Semiconductor device with internal heat dissipation |
| 摘要 |
A thermal management system for a semiconductor chip including at least one region of thermally conductive material included internally within the semiconductor chip.
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| 申请公布号 |
US6573538(B2) |
申请公布日期 |
2003.06.03 |
| 申请号 |
US19980191721 |
申请日期 |
1998.11.12 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
MOTSIFF WILLIAM T.;SHAPIRO MICHAEL J. |
| 分类号 |
H01L23/367;H01L23/58;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/367 |
| 代理机构 |
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