发明名称 |
Apparatus for attaching sand papers on dummy wafers |
摘要 |
An apparatus for attaching an object semi-automatically onto a dummy wafer comprising a stage having a loading surface on which the dummy wafer rests, a pressing device for attaching the object gradually onto the dummy wafer placed on the loading surface, and a supporting device for placing the object in a position spaced apart from the loading surface.
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申请公布号 |
US6571448(B2) |
申请公布日期 |
2003.06.03 |
申请号 |
US20010927339 |
申请日期 |
2001.08.13 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE HO-YEOL;LEE SANG-DO;HWANG IN-SEOK;JI JOON-SU |
分类号 |
H01L21/66;B24B29/02;H01L21/00;H01L51/00;(IPC1-7):B23P19/04 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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