发明名称 Apparatus for attaching sand papers on dummy wafers
摘要 An apparatus for attaching an object semi-automatically onto a dummy wafer comprising a stage having a loading surface on which the dummy wafer rests, a pressing device for attaching the object gradually onto the dummy wafer placed on the loading surface, and a supporting device for placing the object in a position spaced apart from the loading surface.
申请公布号 US6571448(B2) 申请公布日期 2003.06.03
申请号 US20010927339 申请日期 2001.08.13
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE HO-YEOL;LEE SANG-DO;HWANG IN-SEOK;JI JOON-SU
分类号 H01L21/66;B24B29/02;H01L21/00;H01L51/00;(IPC1-7):B23P19/04 主分类号 H01L21/66
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