| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip component alignment device capable of restricting increase of costs by reducing the number of part items and dispensing with a troublesome transfer work of aligned chip parts in automating alignment works of the chip parts. SOLUTION: This device comprises a plate 2b having a chip component alignment surface 2a, an outer frame 3 arranged on the plate 2b for setting a filling area of the chip component C, a part supply part 4 for supplying the chip component C to the plate 2b and a horizontal rotation oscillation mechanism 5 for applying horizontal rotation oscillation to the chip component C supplied to the plate 2b. COPYRIGHT: (C)2003,JPO
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